high density interconnects more expensive
With ever-tightening specifications and demands to pack advanced technology into smaller packages, the demand for denser interconnection has grown exponentially. Conventional printed circuit board technology has surpassed most of the limits of what can be achieved, but new construction techniques have been developed to create even denser interconnections. One such technique is known as high density interconnect (HDI).
A PCB made using high density interconnect methods tends to be tinier as more workings can be crowded into a smaller space. It also provides more opportunities for designers to implement innovative and efficient circuit designs into their products, such as the use of microvias, blind vias, and through-hole pads. The technology can also help improve signal timing and reduce noise in the system.
An important consideration with any PCB design is that of pad size and width, because these affect the affinity between the device and the board. Lessening the pad sizes significantly increases the connection density, and can increase the signal speeds as well. It is vital that engineers take this into account when designing a board, as this can have an impact on the total cost of ownership for the final product.
Are high density interconnects more expensive than rigid ones?
When the pads are sized too large, the affinity between the device and the board may be disrupted. Another way to boost the connection density is to decrease the distance between the pads. This can be achieved by reducing the copper layer thickness, but it should be kept in mind that this will negatively impact on the thermal performance of the board.
The key to successful high-speed HDI pcbs is to ensure the correct design practices are implemented at the beginning of the project. This includes a carefully conceived layer stackup configuration before the layout is started, along with a proper impedance-controlled routing calculation. The use of microvias and blind vias can also aid in reducing manual routing time, while improving signal quality.
Moreover, the right manufacturing partner is essential. The fabricator should be fully equipped to handle the production of complex HDI PCBs, and be able to offer reliable, high-quality outputs at competitive prices. Otherwise, the board maker will be hard-pressed to produce the required quantity with the high yields associated with these boards. This will ultimately translate into huge amounts of waste and a loss for the customer.
Rigid flex PCBs, which are also called rigid-flex PCBs, are hybrid circuits that combine the construction of rigid and flexible components in a single board. They are used in a wide range of applications that require a greater current carrying capacity than is possible with a standard rigid PCB, such as high-speed data communications or industrial equipment.
While the increased current carrying capability of rigid flex PCBs offers many benefits, they do come at a price. This is because these boards are typically more expensive to manufacture than rigid PCBs, and they require a certain amount of flexibility in order to function correctly. This raises the question of whether a rigid-flex PCB is really worth it, or if a different circuit board design is more suitable for the application in question.
